Encapsulation and Sealing of Connectors/PCB/Battery, Car adhesive,
PA adhesive, Low pressure molding Adhesive, adhesive used in wire industry, Polyamide hotmelt adhesive, quality
same as Henkel
Low pressure molding is a gentle injection molding process
utilizing polyamide hot melt adhesives and is designed as a viable
solution for encapsulation and sealing of printed circuit boards
(PCBs), batteries and connectors, and provides effective strain
relief for wire harnesses and cables.
Due to the low pressure during the injection process, electrical
components will keep functioning and even thin wires will not be
released from their contact pins. The hot melt is mainly based on
natural raw materials, the cost for the molds are very low due to
the low pressure and the fact that the hot melt is neither
abrasive, nor corrosive.
Packaging & Shipping
Around 10 days after payment
Q: Are you manufacturer or trader?
A: We're manufacturer, offering high quality and wonderful service
Q: Do you have any certificates?
A: Yes, our product has RoHS, UL
Q: What's the exact usage of Low pressure injection molding
A: Low Pressure Injection Molding Compound Applications:
• Fiber optics
• Cable transitions
• Wire harnesses
We specialize in manufacturing and exporting kinds of chemicals,
PA hot melt adhesive ( Low pressure molding adhesive),
Maleic anhydride, etc.,
which are very competitive and highly respected by our customers.
Please kindly note we welcome your further request for more
It's our sincere wish to work together with each other in the near
Let's talk more!