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HIDAR NEW MATERIAL GROUP LIMITED
HIDAR NEW MATERIAL GROUP LIMITED
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Low pressure molding Adhesive / PA hot melt adhesive

Low pressure molding Adhesive / PA hot melt adhesive

Low pressure molding Adhesive / PA hot melt adhesive

Low pressure molding Adhesive, adhesive for PCB Product Description Low pressure molding is a gentle injection molding process utilizing polyamide hot melt adhesives and is designed as a viable ...

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